TSMC to Begin 3nm Chip Production Next Month
3nm chips from TSMC are getting closer.
TSMC will begin mass producing chips using its leading-edge N3 (3nm-class) manufacturing process this September, according to a Commercial Times report that cites equipment manufacturers. The contract chipmaker will deliver the first products made using its N3 node to its customers early next year.
Traditionally, TSMC begins its high-volume manufacturing (HVM) of a new node sometime in the March to May timeframe to produce enough chips for Apple's latest iPhones, which typically launch in September. But the development of TSMC's N3 node took longer than usual, which is why Apple's upcoming smartphone chips will use a different node. In contrast, the first 3nm chips from TSMC will reach the HVM milestone only in September, which...